Soviet ZX Spectrum clone on a table

ZX Spectrum, Soviet Style: A 44-IC Clone You Can Build

If you’ve ever fancied building a ZX Spectrum clone without hunting down ancient ULAs or soldering your way through 60+ chips, [Alex J. Lowry] has just dropped an exciting build. He has recreated the Leningrad-1, a Soviet-built Spectrum clone from 1988, with a refreshingly low component count: 44 off-the-shelf ICs, as he wrote us. That’s less than many modern clones like the Superfo Harlequin, yet without resorting to programmable logic. All schematics, Gerbers, and KiCad files are open-source, listed at the bottom of [Alex]’ build log.

The original Leningrad-1 was designed by Sergey Zonov during the late Soviet era, when cloning Western tech was less about piracy and more about survival. Zonov’s design nailed a sweet spot between affordability and usability, with enough compatibility to run 90-95% of Spectrum software. [Alex]’ replica preserves that spirit, with a few 21st-century tweaks for builders: silkscreened component values, clever PCB stacking with nylon standoffs, and a DIY-friendly mechanical keyboard hack using transparent keycaps.

While Revision 0 still has some quirks – no SCART color output yet, occasional flickering borders with AY sound – [Alex] is planning for further improvements. Inspired to build your own? Read [Alex]’ full project log here.

Opening Up ASIC Design

The odds are that if you’ve heard about application-specific integrated circuits (ASICs) at all, it’s in the context of cryptocurrency mining. For some currencies, the only way to efficiently mine them anymore is to build computers so single-purposed they can’t do anything else. But an ASIC is a handy tool to develop for plenty of embedded applications where efficiency is a key design goal. Building integrated circuits isn’t particularly straightforward or open, though, so you’ll need some tools to develop them such as OpenRAM.

Designing the working memory of a purpose-built computing system is a surprisingly complex task which OpenRAM seeks to demystify a bit. Built in Python, it can help a designer handle routing models, power modeling, timing, and plenty of other considerations when building static RAM modules within integrated circuits. Other tools for taking care of this step of IC design are proprietary, so this is one step on the way to a completely open toolchain that anyone can use to start building their own ASIC.

This tool is relatively new and while we mentioned it briefly in an article back in February, it’s worth taking a look at for anyone who needs more than something like an FPGA might offer and who also wants to use an open-source tool. Be sure to take a look at the project’s GitHub page for more detailed information as well. There are open-source toolchains if you plan on sticking with your FPGA of choice, though.

The decapped chip on top of some other DIP IC, with magnet wire soldered to the die, other ends of the magnet wire soldered to pins of the "body donor" DIP IC.

Factory Defect IC Revived With Sandpaper And Microsoldering

We might be amidst a chip shortage, but if you enjoy reverse-engineering, there’s never a shortage of intriguing old chips to dig into – and the 2513N 5×7 character ROM is one such chip. Amidst a long thread probing a few of these (Twitter, ThreadReader link), [TubeTime] has realized that two address lines were shorted inside of the package. A Twitter dopamine-fueled quest for truth has led him to try his hand at making the chip work anyway. Trying to clear the short with an external PSU led to a bond wire popping instead, as evidenced by the ESD diode connection disappearing.

A dozen minutes of sandpaper work resulted in the bare die exposed, making quick work of the bond wires as a side effect. Apparently, having the bond pads a bit too close has resulted in a factory defect where two of the pads merged together. No wonder the PSU wouldn’t take that on! Some X-acto work later, the short was cleared. But without the bond wires, how would [TubeTime] connect to it? This is where the work pictured comes in. Soldering to the remains of the bond wires has proven to be fruitful, reviving the chip enough to continue investigating, even if, it appears, it was never functional to begin with. The thread continued on with comparing ROMs from a few different chips [TubeTime] had on hand and inferences on what could’ve happened that led to this IC going out in the wild.

Such soldering experiments are always fun to try and pull off! We rarely see soldering on such a small scale, as thankfully, it’s not always needed, but it’s a joy to witness when someone does IC or PCB microsurgery to fix factory defects that render our devices inoperable before they were even shipped. Each time that a fellow hacker dares to grind the IC epoxy layers down and save a game console or an unidentified complex board, the world gets a little brighter. And if you aren’t forced to do it for repair reasons, you can always try it in an attempt to build the smallest NES in existence!

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Garage Semiconductor Fab Gets Reactive-Ion Etching Upgrade

It’s a problem that few of us will likely ever face: once you’ve built your first homemade integrated circuit, what do you do next? If you’re [Sam Zeloof], the answer is clear: build better integrated circuits.

At least that’s [Sam]’s plan, which his new reactive-ion etching setup aims to make possible. While his Z1 dual differential amplifier chip was a huge success, the photolithography process he used to create the chip had its limitations. The chemical etching process he used is a bit fussy, and prone to undercutting of the mask if the etchant seeps underneath it. As its name implies, RIE uses a plasma of highly reactive ions to do the etching instead, resulting in finer details and opening the door to using more advanced materials.

[Sam]’s RIE rig looks like a plumber’s stainless steel nightmare, in the middle of which sits a vacuum chamber for the wafer to be etched. After evacuating the air, a small amount of fluorinated gas — either carbon tetrafluoride or the always entertaining sulfur hexafluoride — is added to the chamber. A high-voltage feedthrough provides the RF energy needed to create a plasma, which knocks fluorine ions out of the process gas. The negatively charged and extremely reactive fluorine ions are attracted to the wafer, where they attack and etch away the surfaces that aren’t protected by a photoresist layer.

It all sounds simple enough, but the video below reveals the complexity. There are a lot of details, like correctly measuring vacuum, avoiding electrocution, keeping the vacuum pump oil from exploding, and dealing with toxic waste products. Hats off to [Sam’s dad] for pitching in to safely pipe the exhaust gases through the garage door. This ties with [Huygens Optics]’s latest endeavor for the “coolest things to do with fluorine” award.

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