Bar of conductive filament with leds and a battery

Putting Conductive TPU To The Test

Ever pried apart an LCD? If so, you’ve likely stumbled at the unassuming zebra strip — the pliable connector that makes bridging PCB pads to glass traces look effortless. [Chuck] recently set out to test if he could hack together his own zebra strip using conductive TPU and a 3D printer.

[Chuck] started by printing alternating bands of conductive and non-conductive TPU, aiming to mimic the compressible, striped conductor. Despite careful tuning and slow prints, the results were mixed to say the least. The conductive TPU measured a whopping 16 megaohms, barely touching the definition of conductivity! LEDs stayed dark, multimeters sulked, and frustration mounted. Not one to give up, [Chuck] took to his trusty Proto-pasta conductive PLA, and got bright, blinky success. It left no room for flexibility, though.

It would appear that conductive TPU still isn’t quite ready for prime time in fine-pitch interconnects. But if you find a better filament – or fancy prototyping your own zebra strip – jump in! We’d love to hear about your attempts in the comments.

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A Transistor, But For Heat Instead Of Electrons

Researchers at UCLA recently developed what they are calling a thermal transistor: a solid-state device able to control the flow of heat with an electric field. This opens the door to controlling the transfer of heat in some of the same ways we are used to controlling electronics.

Heat management can be a crucial task, especially where electronics are involved. The usual way to manage heat is to draw it out with things like heat sinks. If heat isn’t radiating away fast enough, a fan can be turned on (or sped up) to meet targets. Compared to the precision and control with which modern semiconductors shuttle electrons about, the ability to actively manage heat seems lacking.

This new device can rapidly adjust thermal conductivity of a channel based on an electrical field input, which is very similar to what a transistor does for electrical conductivity. Applying an electrical field modifies the strength of molecular bonds in a cage-like array of molecules, which in turn adjusts their thermal conductivity.

It’s still early, but this research may open the door to better control of heat within semiconductor systems. This is especially interesting considering that 3D chips have been picking up speed for years (stacking components is already a thing, it’s called Package-on-Package assembly) and the denser and deeper semiconductors get, the harder it is to passively pull heat out.

Thanks to [Jacob] for the tip!